JPS6218075Y2 - - Google Patents
Info
- Publication number
- JPS6218075Y2 JPS6218075Y2 JP14848379U JP14848379U JPS6218075Y2 JP S6218075 Y2 JPS6218075 Y2 JP S6218075Y2 JP 14848379 U JP14848379 U JP 14848379U JP 14848379 U JP14848379 U JP 14848379U JP S6218075 Y2 JPS6218075 Y2 JP S6218075Y2
- Authority
- JP
- Japan
- Prior art keywords
- inner conductor
- conductor layer
- printed wiring
- layer
- multilayer printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004020 conductor Substances 0.000 claims description 29
- 239000000758 substrate Substances 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- 239000011889 copper foil Substances 0.000 description 9
- 238000005553 drilling Methods 0.000 description 5
- 230000017525 heat dissipation Effects 0.000 description 4
- 238000003486 chemical etching Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 230000002493 climbing effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000001151 other effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14848379U JPS6218075Y2 (en]) | 1979-10-26 | 1979-10-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14848379U JPS6218075Y2 (en]) | 1979-10-26 | 1979-10-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5665681U JPS5665681U (en]) | 1981-06-01 |
| JPS6218075Y2 true JPS6218075Y2 (en]) | 1987-05-09 |
Family
ID=29379615
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14848379U Expired JPS6218075Y2 (en]) | 1979-10-26 | 1979-10-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6218075Y2 (en]) |
-
1979
- 1979-10-26 JP JP14848379U patent/JPS6218075Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5665681U (en]) | 1981-06-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH07283538A (ja) | 多層プリント配線板の製造方法 | |
| JP2813682B2 (ja) | 電子部品搭載用基板 | |
| JPH09107162A (ja) | プリント回路基板 | |
| US6221694B1 (en) | Method of making a circuitized substrate with an aperture | |
| JP2003198085A (ja) | 回路基板およびその製造方法 | |
| JPS6218075Y2 (en]) | ||
| JP4187049B2 (ja) | 多層配線基板とそれを用いた半導体装置 | |
| JP2002076636A (ja) | 配線基板及び配線基板の製造方法 | |
| JPH11284300A (ja) | プリント配線板 | |
| JP2000323841A (ja) | 多層回路基板とその製造方法 | |
| JPH0219982Y2 (en]) | ||
| JPH10261854A (ja) | プリント配線板及びその製造方法 | |
| JP2784523B2 (ja) | 電子部品搭載用基板 | |
| JPH06188572A (ja) | 金属コア入りプリント配線基板 | |
| JP2784521B2 (ja) | 多層電子部品塔載用基板及びその製造法 | |
| JP2867631B2 (ja) | 半導体チップキャリア | |
| JPS5828378Y2 (ja) | 多層プリント配線板 | |
| JP2019029559A (ja) | 多層配線板及びその製造方法 | |
| JPH0542158B2 (en]) | ||
| JP2517315B2 (ja) | 電子回路パッケ―ジ | |
| JP2681292B2 (ja) | 多層プリント配線板 | |
| JP3283573B2 (ja) | 多層印刷配線板 | |
| JPH1051094A (ja) | プリント配線板及びその製造方法 | |
| JPS6214717Y2 (en]) | ||
| JPS622787Y2 (en]) |